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BD6083GUL
Datasheet
● Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and ground
lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external
circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between
the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the
pin and the power supply or the ground pin, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower
than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input
pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to
the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This IC builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher,
the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating
the IC from thermal runaway as much as possible, is not aimed at the protection or guarantee of the IC. Therefore, do not
continuously use the IC with this circuit operating or use the IC assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because
it has the possibility that an operation becomes unstable.
(11) About the rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width
of ground wiring, and routing of wiring.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
40/42
TSZ02201-0G3G0C200100-1-2
05.Oct.2012 Rev.001
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